Self-aligned memory decks in cross-point memory arrays

ABSTRACT

A multi-layer memory device with an array having multiple memory decks of self-selecting memory cells is provided in which N memory decks may be fabricated with N+1 mask operations. The multiple memory decks may be self-aligned and certain manufacturing operations may be performed for multiple memory decks at the same time. For example, patterning a bit line direction of a first memory deck and a word line direction in a second memory deck above the first memory deck may be performed in a single masking operation, and both decks may be etched in a same subsequent etching operation. Such techniques may provide efficient fabrication which may allow for enhanced throughput, additional capacity, and higher yield for fabrication facilities relative to processing techniques in which each memory deck is processed using two or more mask and etch operations per memory deck.

BACKGROUND

The following relates generally to multi-layer memory arrays and morespecifically to self-aligned memory decks in cross-point memory arraysin which N memory decks may use N+1 patterning and etch operations.

Memory devices are widely used to store information in variouselectronic devices such as computers, wireless communication devices,cameras, digital displays, and the like. Information is stored byprogramming different states of a memory device. For example, binarydevices have two states, often denoted by a logic “1” or a logic “0.” Inother systems, more than two states may be stored. To access the storedinformation, a component of the electronic device may read, or sense,the stored state in the memory device. To store information, a componentof the electronic device may write, or program, the state in the memorydevice.

Multiple types of memory devices exist, including magnetic hard disks,random access memory (RAM), dynamic RAM (DRAM), synchronous dynamic RAM(SDRAM), ferroelectric RAM (FeRAM), magnetic RAM (MRAM), resistive RAM(RRAM), read only memory (ROM), flash memory, phase change memory (PCM),and others. Memory devices may be volatile or non-volatile. Non-volatilememory, e.g., flash memories or FeRAM, may maintain their stored logicstate for extended periods of time even in the absence of an externalpower source. Volatile memory devices, e.g., DRAM, may lose their storedstate over time unless they are periodically refreshed by an externalpower source. Improving memory devices may include increasing memorycell density, increasing read/write speeds, increasing reliability,increasing data retention, reducing power consumption, or reducingmanufacturing costs, among other metrics. Some types of memory devicesmay use variations in resistance or voltage drop across a cell toprogram and sense different logic states. For example, self-selectingmemory may leverage ion migration properties in a cell.

Fabricating a memory device may include forming, patterning, andremoving material according to patterns that define portions of thememory device. Fabrication is generally performed in clean rooms usinghighly specialized fabrication equipment, and fabrication facilities areoften referred to as “wafer fabs” or “semiconductor fabs.” Suchfabrication facilities and associated equipment require substantialcapital investment, and thus efficient manufacturing may enhance thethroughput and utilization of such facilities.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example of a memory array that supportsself-aligned memory decks in cross-point memory arrays in accordancewith aspects of the present disclosure.

FIG. 2 illustrates an example of self-aligned memory decks in across-point memory array in accordance with aspects of the presentdisclosure.

FIG. 3 illustrates a block diagram of a cross point memory device thatsupports features and operations in accordance with examples of thepresent disclosure.

FIGS. 4A and 4B illustrate cross-sections of a portion of a first memorydeck during fabrication in accordance with examples of the presentdisclosure.

FIGS. 5A and 5B illustrate cross-sections of a portion of the firstmemory deck following first row processing during fabrication inaccordance with examples of the present disclosure.

FIGS. 6A and 6B illustrate cross-sections of a portion of the firstmemory deck and a second memory deck during fabrication in accordancewith examples of the present disclosure.

FIGS. 7A, 7B, and 7C illustrate cross-sections of a portion of the firstmemory deck and the second memory deck following first column processingduring fabrication in accordance with examples of the presentdisclosure.

FIGS. 8A and 8B illustrate cross-sections of a portion of the firstmemory deck and the second memory deck following top electrodedeposition during fabrication in accordance with examples of the presentdisclosure.

FIGS. 9A and 9B illustrate cross-sections of a portion of the firstmemory deck and the second memory deck following second row processingduring fabrication in accordance with examples of the presentdisclosure.

FIGS. 10A and 10B illustrate cross-sections of a portion of the firstmemory deck, the second memory deck, and a third memory deck duringfabrication in accordance with examples of the present disclosure.

FIGS. 11A and 11B illustrate cross-sections of a portion of the firstmemory deck, the second memory deck, and the third memory deck followingsecond row processing during fabrication in accordance with examples ofthe present disclosure.

FIGS. 12A and 12B illustrate cross-sections of a portion of the firstmemory deck, the second memory deck, and the third memory deck followingtop electrode deposition and second column processing during fabricationin accordance with examples of the present disclosure.

FIGS. 13A and 13B illustrate cross-sections of a portion of self-alignedmemory decks during fabrication in accordance with examples of thepresent disclosure.

FIGS. 14 through 17 illustrate a method or methods for fabricating aself-aligned memory decks in cross-point memory arrays in accordancewith aspects of the present disclosure.

DETAILED DESCRIPTION

A multi-layer memory device with an array having multiple memory decksof self-selecting memory cells in which N memory decks may be fabricatedwith N+1 mask operations. Techniques discussed herein may allow forimproved manufacturing efficiency and reduced manufacturing cost.Additionally, the multiple memory decks may be self-aligned and certainmanufacturing operations may be performed for multiple memory decks atthe same time. In some cases, patterning a bit line direction of a firstmemory deck and a word line direction in a second memory deck above thefirst memory deck may be performed in a single masking operation, andboth decks may be etched in a subsequent etching operation. Suchtechniques may provide efficient fabrication which may allow forenhanced throughput and additional capacity for fabrication facilitiesrelative to processing techniques in which each memory deck is processedusing two or more mask and etch operations. Furthermore, fewerprocessing steps may also reduce the likelihood of defects in memorydecks, which may increase yield.

Self-selecting memory may leverage ion migration properties of phasechange materials for programming and subsequently sensing a logic state.A self-selecting memory cell may include a memory storage elementsurrounded by a first electrode and a second electrode. Self-selectingmemory is a crossbar memory element that comprises one single elementthat works for selection and storage. Non-linear current voltagecharacteristics allow the memory element to be used as selector with alow voltage off region and a high voltage on state, similar to a diode.At the same time, the current voltage characteristics show at least twoprogrammable states, thus behaving as a memory element. Self-selectingmemory may be employed, in some examples, for relatively time-sensitiveoperations, such as random access memory (RAM) tasks.

In some examples, a cell of a first crossbar memory array and a cell ofsecond crossbar memory array stacked on the first crossbar memory arraymay be operated as a multilevel cell. A multilevel cell (MLC) maycontain two or more physical mechanisms (e.g., memory elements), eachseparated by an electrode and may allow more than two data (e.g.,multiple bits) to be stored.

Features and techniques introduced above are further described below inthe context of a memory array having multiple decks of memory cells.Specific examples are then described for fabricating multi-layer memoryarrays that include self-selecting memory cells, although techniquesdiscussed herein may be used for other phase change memory cells (e.g.,a phase change memory cell that includes a phase change material (PCM)element and a separate selection element). These and other features ofthe disclosure are further illustrated by and described with referenceto apparatus diagrams, system diagrams, and flowcharts.

FIG. 1 illustrates an example memory array 100 in accordance withvarious embodiments of the present disclosure. Memory array 100 may alsobe referred to as an electronic memory apparatus. Memory array 100includes memory cells 105 that are programmable to store differentstates. Each memory cell 105 may be programmable to store two states,denoted as a logic 0 and a logic 1. In some cases, memory cell 105 isconfigured to store more than two logic states.

A memory cell 105 may include a material, which may be referred to as amemory element or memory storage element, that has a variable andconfigurable electrical resistance that is representative of the logicstates. For example, a crossbar memory cell may include a memory elementwith a material in an amorphous state, and that may have a thresholdvoltage associated with it—that is, current flows after the thresholdvoltage is exceed. Different threshold voltages may allow SET versusRESET states to be distinguished.

Memory array 100 may be a three-dimensional (3D) memory array, wheretwo-dimensional (2D) memory arrays are formed on top of one another.This may increase the number of memory cells that may formed on a singledie or substrate as compared with 2D arrays, which in turn may reduceproduction costs or increase the performance of the memory array, orboth. According to the example depicted in FIG. 1, memory array 100includes two levels (which may also be referred to, in some examples, as“layers”) of memory cells 105 and may thus be considered athree-dimensional memory array; however, the number of levels is notlimited to two. Each level may be aligned or positioned so that memorycells 105 may be aligned with one another across each level, forming amemory cell stack 145.

Each row of memory cells 105 is connected to a word line 110, and eachcolumn of memory cells 105 is connected to a bit line 115. Word lines110 and bit lines 115 may be substantially perpendicular to one anotherto create an array. As shown in FIG. 1, the two memory cells 105 in amemory cell stack 145 may share a common access line such as a bit line115. That is, a bit line 115 may be in electronic communication with thebottom electrode of the upper memory cell 105 and the top electrode ofthe lower memory cell 105. Other configurations may be possible, forexample, a third layer may share a word line 110 with a lower layer. Ingeneral, one memory cell 105 may be located at the intersection of twoaccess lines such as a word line 110 and a bit line 115. Thisintersection may be referred to as a memory cell's address. A targetmemory cell 105 may be a memory cell 105 located at the intersection ofan energized word line 110 and bit line 115; that is, a word line 110and a bit line 115 may be energized in order to read or write a memorycell 105 at their intersection. Other memory cells 105 that are inelectronic communication with (e.g., connected to) the same word line110 or bit line 115 may be referred to as untargeted memory cells 105.

As discussed above, electrodes may be coupled to a memory cell 105 andan word line 110 or a bit line 115. The term electrode may refer to anelectrical conductor, and in some cases, may be employed as anelectrical contact to a memory cell 105. An electrode may include atrace, wire, conductive line, conductive layer, or the like thatprovides a conductive path between elements or components of memoryarray 100.

Operations such as reading and writing may be performed on memory cells105 by activating or selecting word line 110 and digit line 115. Wordlines 110 may also be known as row lines 110, and bit lines 115 may alsobe known digit lines 115. References to word lines and bit lines, ortheir analogues, are interchangeable without loss of understanding oroperation, and word lines and bit lines may be referred to generally asaccess lines. Activating or selecting a word line 110 or a digit line115 may include applying a voltage to the respective line. Word lines110 and digit lines 115 may be made of conductive materials such asmetals (e.g., copper (Cu), aluminum (Al), gold (Au), tungsten (W),etc.), metal alloys, carbon, conductively-doped semiconductors, or otherconductive materials, alloys, compounds, or the like.

Accessing memory cells 105 may be controlled through a row decoder 120and a column decoder 130. For example, a row decoder 120 may receive arow address from the memory controller 140 and activate the appropriateword line 110 based on the received row address. Similarly, a columndecoder 130 receives a column address from the memory controller 140 andactivates the appropriate digit line 115. For example, memory array 100may include multiple word lines 110, labeled WL_1 through WL_M, andmultiple bit lines 115, labeled BL_1 through BL_N, where M and N dependon the array size. Thus, by activating a word line 110 and a bit line115, e.g., WL_2 and BL_3, the memory cell 105 at their intersection maybe accessed.

Upon accessing, a memory cell 105 may be read, or sensed, by sensecomponent 125 to determine the stored state of the memory cell 105. Forexample, a voltage may be applied to a memory cell 105 (using thecorresponding word line 110 and bit line 115) and the presence of aresulting current may depend on the applied voltage and the thresholdvoltage of the memory cell 105. In some cases, more than one voltage maybe applied. Additionally, if an applied voltage does not result incurrent flow, other voltages may be applied until a current is detectedby sense component 125. By assessing the voltage that resulted incurrent flow, the stored logic state of the memory cell 105 may bedetermined. In some cases, the voltage may be ramped up in magnitudeuntil a current flow is detected. In other cases, predetermined voltagesmay be applied sequentially until a current is detected. Likewise, acurrent may be applied to a memory cell 105 and the magnitude of thevoltage to create the current may depend on the electrical resistance orthe total threshold voltage of the memory cell 105.

Sense component 125 may include various transistors or amplifiers inorder to detect and amplify a difference in the signals, which may bereferred to as latching. The detected logic state of memory cell 105 maythen be output through column decoder 130 as output 135. In some cases,sense component 125 may be part of a column decoder 130 or row decoder120. Or, sense component 125 may be connected to or in electroniccommunication with column decoder 130 or row decoder 120.

The memory controller 140 may control the operation (e.g., read, write,re-write, refresh, decharge, etc.) of memory cells 105 through thevarious components, for example, row decoder 120, column decoder 130,and sense component 125. In some cases, one or more of the row decoder120, column decoder 130, and sense component 125 may be co-located withthe memory controller 140. Memory controller 140 may generate row andcolumn address signals in order to activate the desired word line 110and digit line 115. Memory controller 140 may also generate and controlvarious voltages or currents used during the operation of memory array100. For example, it may apply discharge voltages to a word line 110 ordigit line 115 after accessing one or more memory cells 105. In general,the amplitude, shape, or duration of an applied voltage or currentdiscussed herein may be adjusted or varied and may be different for thevarious operations discussed in operating memory array 100. Furthermore,one, multiple, or all memory cells 105 within memory array 100 may beaccessed simultaneously; for example, multiple or all cells of memoryarray 100 may be accessed simultaneously during a reset operation inwhich all memory cells 105, or a group of memory cells 105, are set to asingle logic state.

FIG. 2 illustrates an embodiment of a multi-layer cross point memorydevice that supports features and operations in accordance with examplesof the present disclosure. Memory device 200 may be an example ofportions of memory array 100 described with reference to FIG. 1. Memorydevice 200 may include a first array or deck 205 of cells and secondarray or deck 210 of cells on top of the first array. Memory device 200may also include word line 110-a and word line 110-b, and bit line115-a, which may be examples of word line 110 and bit line 115, asdescribed with reference to FIG. 1. Memory cells of the second deck 210of cells may have a self-selecting memory storage element and mayoverlie corresponding memory cells of the first deck 205 of cells.

Memory cells of the first deck 205 of cells may include first electrodelayer 215-a, memory storage element layer 220-a, and second electrodelayer 225-a. Second memory deck 210 may include a separate deck ofmemory cells, that may include a first electrode layer 215-b, memorystorage element layer 220-b, and second electrode layer 225-b. In otherembodiments, other structures may be fabricated, such as a structure inwhich one or more electrode (e.g., carbon) layers are only defined alongone direction (e.g., the WL and/or the BL direction). For example, suchan alternative structure may be implemented by performing the electrodelayer deposition and array patterning according to a modified sequence,to deposit word line 110-a, first electrode layer 215-a and memorystorage element layer 220-a; patterning along the word line (110-a)direction before depositing second electrode layer 225-a, bit line 115-alayer, electrode layer 215-b and self-selecting memory storage elementlayer 220-b; and patterning along the bit line (115-a) direction,interrupting the patterning etch after the self-selecting memorymaterial is defined in both directions. At this point there may still beportions of the electrode layer 215-a adjacent to word line 110-a thatis continuous in the wordline direction (which may act as a shunt to thewordline). Additionally, in such an embodiment, the electrode layersadjacent to the bit line 115-a may act as shunts to the bit line 115-aitself (e.g., extending in one direction and in continuous lines in thebit line direction). In some cases, the electrode material may becompletely avoided.

The memory cells of the first deck 205 of cells and second deck 210 ofcells may, in some examples, have common conductive lines such thatcorresponding cells of each deck 205 and 210 of cells may share bitlines 115 or word lines 110 as described with reference to FIG. 1. Forexample, first electrode layer 215-b of the second deck of cells and thesecond electrode layer 225-a of the first deck 205 of cells may becoupled to bit line 115-a such that bit line 115-a is shared byvertically adjacent memory cells.

The architecture of memory device 200 may be referred to as across-point architecture. It may also be referred to as a pillarstructure. For example, as shown in FIG. 2, a pillar (e.g., first memorydeck 205 that includes first memory cells) may be in contact with afirst conductive line (e.g., word line 110-a) and a second conductiveline (e.g., bit line 115-a), where pillars of the first memory deck 205comprises first electrode layer 215-a, memory storage element layer220-a, and second electrode layer 225-a. Correspondingly, pillars of thesecond memory deck 210 may be in contact with a first conductive line(e.g., bit line 115-a) and a second conductive line (e.g., word line110-b) and may include first electrode layer 215-b, memory storageelement layer 220-b and second electrode layer 225-b.

Such a pillar architecture may offer relatively high-density datastorage with lower production costs compared to other memoryarchitectures. For example, the cross-point architecture may have memorycells with a reduced area and, resultantly, an increased memory celldensity compared to other architectures. For example, the architecturemay have a 4F² memory cell area, where F is the smallest feature size,compared to other architectures with a 6F² memory cell area, such asthose with a three-terminal selection. For example, DRAM may use atransistor, which is a three-terminal device, as the selection componentfor each memory cell and may have a larger memory cell area compared tothe pillar architecture.

As mentioned, multiple memory cells may be referred to as a memoryarray. So the first array may be or may include a first deck of athree-dimensional cross point memory architecture and the second arraymay include a second deck of the three-dimensional cross point memoryarchitecture. The first deck may and the second deck may have a firstpitch or aspect ratio that is reduced relative to PCM memory cells thatmay have both a memory storage element and a selection device. In somecases, different decks may be characterized by different pitches in thetwo directions. For example, the cross-section in a top view of thestorage element, and possibly the associated pillar, may be a rectanglerather than a square (e.g., each pair of opposite sides beingself-aligned to a respective etching mask, such as either in wordline orbitline direction). Such different pitches may be obtained by differenthard masking dimensions or by lateral over-etch during patterning, forexample. Other top view cross-sections may also be possible, such aselliptic or circular elements and possibly associated pillars.

While the example of FIG. 2 shows two memory decks, other configurationsare possible. For example, a three or four memory decks may beconfigured in a similar manner in a three-dimensional cross pointarchitecture. In some examples, one or more of the memory decks mayinclude PCM cells that include both a phase change memory storage deviceand a selection device. For example, four decks of memory arrays may bepresent, with a lowest deck including PCM cells, the middle two decksincluding self-selecting memory cells, and the highest deck includingPCM cells. In some embodiments, one or more the PCM decks may be abovewordlines or bitlines (e.g., PCM cells are on off decks andself-selecting memory cells are on even decks, or vice-versa), such thatthe PCM cells and the self-selecting memory cells may be addressed inthe same way. The aspect ratio of the decks of self-selecting memorycells may be such that common patterning and etching steps may be usedfor the self-selecting memory decks, as discussed in more detail below.Memory storage element layers 220 may, for example, include achalcogenide glass such as, for example, an alloy of selenium (Se),tellurium (Te), arsenic (As), antimony (Sb), carbon (C), germanium (Ge),and silicon (Si).

Memory device 200 may be made by various combinations of materialformation and removal. For example, layers of material may be depositedthat correspond to the word line 110-a, first electrode layer 215-a,memory storage element layer 220-a, second electrode layer 225-a, bitline 115-a, first electrode layer 215-b, memory storage element layer220-b, second electrode layer 225-b, and word line 110-b. Material maybe selectively removed to then create the desired features, such as thepillar structure depicted in FIG. 2, as will be discussed in more detailwith respect to FIGS. 4 through 13. The electrode layers may be formedof, for example, carbon, although other materials may be used for theelectrode layers, such as any adhesion or barrier layer material (e.g.,W, Ti, TiN, Cr, Ni, Ta, etc., or combinations thereof).

A memory device having the pillar structure illustrated in FIG. 2 andfabricated according to techniques may provide a number of benefits overa memory device that uses a separate PCM memory element and selectiondevice element (both of which may include chalcogenide glass). Forexample, the pillar structure of memory device 200 provides a reducedaspect ratio of the cell stack, and in some cases the resultingthickness may be less than half of a memory cell that includes both aPCM memory element and selection device. Additionally, self-selectingmemory devices such as in memory device 200 may have metallizationlayers for access lines (e.g., bit lines and word lines) with reducedthickness relative to memory cells that include both a PCM memoryelement and selection device, as self-selecting memory devices use thepolarity effect as discussed above which may be achieved with relativelylow currents (e.g., 20% to 30% of the programming currents of PCM memoryelements). Thus, metal layer thicknesses can be reduced whilemaintaining necessary voltage drops in the array.

Furthermore, memory cells that include both a PCM memory element and aselection device may use different compositions of chalcogenide glassfor the PCM memory element and the selection device. These differentcompositions of chalcogenide glass present cross-contamination issues ifone of the compositions is exposed to another of the compositions inetching operations, and such cross-contamination may cause significantmodification of the electrical properties of the chalcogenide glasslayers. Thus, when fabricating memory cells that have both a PCM memoryelement and a selection device, cross-contamination is prevented throughseparate etching and sealing sequences that avoid exposure of bothchalcogenide glass layers at the same time. The self-selecting memorycell structure uses only a single chalcogenide glass layer in each deck205 and 210, thus limiting the sources for cross-contamination. Varioustechniques provided herein allow for fabrication in which separatechalcogenide glass layers in multiple memory decks may be exposed at thesame time in an etch operation. As mentioned above, such techniques mayprovide an N-deck memory array that is fabricated using N+1 mask andetch operations.

FIG. 3 shows an exemplary multi-layer cross point memory device 300 thatsupports features and operations in accordance with examples of thepresent disclosure. Device 300 may be referred to as an electronicmemory apparatus. Memory device 200-a may include a first memory deck305 and second memory deck 310. First memory deck 305 may include anarray of cells similar to first deck 205 described with reference toFIG. 2. Second memory deck 310 may include an array of cells similar tosecond deck 210 described with reference to FIG. 2. First memory deck305 may be coupled to second memory deck 310. First memory deck 305 mayinclude a first memory cell that includes a self-selecting memorystorage element coupled between a first access line and a second accessline, and second memory deck 310 may include a second memory cell thatincludes a self-selecting memory storage element coupled between thesecond access line and a third access line. Each self-selecting memorystorage element may include a self-selecting memory stack that mayinclude, for example, a layer of carbon, a memory storage element layer,and another layer of carbon. In other embodiments, the self-selectingmemory storage elements may have different stacks of materials, and insome embodiments different memory decks may have different stacks ofmaterials. In some embodiments, as discussed above, one or moreelectrode layers may be defined only along one direction (e.g., the WLand/or the BL direction). Furthermore, in some embodiments, differentpitches in the wordline and bitline directions may be present.

Memory device 200-a may be coupled with interface 315 that may becoupled to first memory deck 305 and to word line 110-c and bit line115-b. Interface 315 may also be referred to as control circuitry andmay be oriented such that the first array and the second array overlieinterface 315. These components may be in electronic communication witheach other and may perform one or more of the functions describedherein. In some cases, memory controller 140-a may include biasingcomponent 320 and timing component 325. Memory controller 140-a may bein electronic communication with word line 110-c, bit line 115-b, andsense component 125-a, which may be examples of word line 110, bit line115, and sense component 125, as described with reference to FIGS. 1 and2. In some cases, sense component 125-a and latch 330 may be componentsof memory controller 140-a. These components may also be in electroniccommunication with other components, both inside and outside of memoryarray device, in addition to components not listed above, via othercomponents, connections, or busses.

Memory controller 140-a may be configured to activate word line 110-c orbit line 115-b by applying voltages to those various nodes. For example,biasing component 320 may be configured to apply a voltage to operatememory array device to read or write first memory deck 305 and secondmemory deck 310 as described above. In some cases, memory controller140-a may include a row decoder, column decoder, or both, as describedwith reference to FIG. 1. This may enable memory controller 140-a toaccess one or more memory cells. Biasing component 320 may provide avoltage for the operation of sense component 125-a. In the example ofFIG. 3, biasing component 320 is shown as a component of memorycontroller 140-a; but biasing component 320 may be external to memorycontroller 140-a. Biasing component 320 may be managed inside a memorychip that includes the first memory deck 305 and the second memory deck310.

Interface 315 may be coupled to memory controller 140-a via word line110-c and digit line 115-b. Interface 315 may be configured to write afirst logic value to a memory storage element of a cell of the firstmemory deck 305 (e.g., to memory storage element layer 220-a of FIG. 2).A first state may be written to the first memory deck 305 using a firstpolarity. Similarly, interface 315 may be configured to write a secondlogic value to a memory storage element of a cell of the second memorydeck 310 (e.g., to memory storage element layer 220-b of FIG. 2). Afirst state may be written to the second memory deck 310 using a secondpolarity. The second polarity may be opposite the first polarity.

Interface 315 may be configured to read the first logic value written toa cell of the first memory deck 305 and the second logic value writtento the corresponding cell of the second memory deck 310. The logicvalues may be read using a second polarity, which may be opposite of thefirst polarity.

In some cases, memory controller 140-a may perform its operations usingtiming component 325. For example, timing component 325 may control thetiming of the various word line selections or plate biasing, includingtiming for switching and voltage application to perform the memoryfunctions, such as reading and writing, discussed herein. In some cases,timing component 325 may control the time of operations of biasingcomponent 320.

Upon determining a logic state of first memory deck 305 and secondmemory deck 310, the sense component 125-a may store the output in latch330, where it may be used in accordance with the operations of anelectronic device that includes memory device 300. Sense component 125-amay include a sense amplifier in electronic communication with the latchand memory device 200-a.

Memory controller 140-a, or at least some of its various sub-componentsmay be implemented in hardware, software executed by a processor,firmware, or any combination thereof. If implemented in softwareexecuted by a processor, the functions of the memory controller 140-a,or at least some of its various sub-components, may be executed by ageneral-purpose processor, a digital signal processor (DSP), anapplication-specific integrated circuit (ASIC), an field-programmablegate array (FPGA) or other programmable logic device, discrete gate ortransistor logic, discrete hardware components, or any combinationthereof designed to perform the functions described in the presentdisclosure.

The memory controller 140-a, or at least some of its varioussub-components, may be physically located at various positions,including being distributed such that portions of functions areimplemented at different physical locations by one or more physicaldevices. In some examples, memory controller 140-a, or at least some ofits various sub-components, may be a separate and distinct component inaccordance with various examples of the present disclosure. In otherexamples, memory controller 140-a, or at least some of its varioussub-components, may be combined with one or more other hardwarecomponents.

FIGS. 4A and 4B show a portion of a first memory deck of a multi-layercross point memory device 400 in accordance with examples of the presentdisclosure. FIG. 4A shows a cross-section of the first memory deck in anX-direction in which a first set of access lines (e.g., word lines 110)may be perpendicular to the X-direction and a second set of access lines(e.g., bit lines 115) may be parallel to the X-direction. Similarly,FIG. 4B shows a cross-section of the first memory deck in a Y-directionin which the first set of access lines (e.g., word lines 110) may beparallel to the Y-direction and the second set of access lines (e.g.,bit lines 115) may be perpendicular to the Y-direction. The portion ofthe first memory deck may be, for example a portion of the first memorydeck 205 described with reference to FIG. 2.

In this embodiment, a blanket deposition of a lower electrodemetallization layer, which may be used to form the metallization for theword line 110-d layer of the first memory deck, may be deposited on asubstrate, followed by formation of a first electrode layer 215-c,memory storage element layer 220-c, and second electrode layer 225-c.These layers may, after processing, be examples of word lines 110 andmemory cells 105 of first memory deck 205 as described with reference toFIGS. 1 and 2. Memory storage element layer 220-c may, for example, be avariable resistance material, a chalcogenide, or a phase changematerial. Word line 110-d layer may be a conductive layer and mayinclude, in some examples, tungsten, aluminum, titanium, titaniumnitride, silicon, polysilicon, or any combination thereof. Varioustechniques may be used to deposit the layers of FIG. 4, such as, forexample, chemical vapor deposition (CVD), metal-organic chemical vapordeposition (MOCVD), plasma-enhanced CVD (PECVD), physical vapordeposition (PVD), sputter deposition, atomic layer deposition (ALD), ormolecular beam epitaxy (MBE), among other thin film growth techniques.In some examples, the substrate, or a portion thereof, may include othercomponents of a memory device, such as logic circuitry associated withthe memory controller 140, interface 315, sense component 125, latch330, or any combination thereof, as discussed above with reference toFIGS. 1 through 3. In some examples, the substrate, or a portionthereof, may be a silicon substrate, an insulating substrate such assilicon dioxide or silicon nitride, a polysilicon substrate, or anycombination thereof.

FIGS. 5A and 5B show a portion of a first memory deck of a multi-layercross point memory device 500 following a first patterning operation, afirst etching operation, and a first filling operation in accordancewith examples of the present disclosure. FIG. 5A shows the cross-sectionin the X-direction and FIG. 5B shows the cross-section in theY-direction, similarly as discussed above with respect to FIGS. 4A and4B.

In this example, a first set of rows 515 may be patterned on the secondelectrode layer 225-c in the first patterning operation. The first setof rows 515 may be rows that are patterned to correspond to word lines110 of FIGS. 1-2. In some instances, the pattern may be formed usingphotolithography techniques. Following the patterning, the first etchingoperation may etch portions of the second electrode layer 225-c, thememory storage element layer 220-c, the first electrode layer 215-c andthe word line 110-d layer that are between the patterned first set ofrows 515. The first etching operation may remove material using a numberof techniques, which may include, for example, chemical etching (alsoreferred to as “wet etching”), plasma etching (also referred to as “dryetching”), or combinations thereof.

The first filling operation may include depositing a sealing layer 505on the first set of rows 515, and depositing a dielectric material 510between rows of the first set of rows 515. In some cases, the firstfilling operation may include a planarization operation, such aschemical mechanical planarization (CMP) to planarize the portion of thefirst memory deck.

The sealing layer 505 may include, for example, an insulating materialsuch as silicon nitride, silicon oxide, or silicon oxynitride, which maybe deposited using one or more of PECVD, CVD, ALD, or spin-on, just toname a few examples. The dielectric material 510 may include, forexample, an insulating material such as silicon nitride, silicon oxide,or silicon oxynitride, which may be deposited using one or more of thedeposition techniques as discussed above. In some cases, the sealinglayer 505 may be deposited at a lower temperature to help preventoutgassing from chalcogenide glass that may be used in memory storageelement layer 220-a, and the dielectric material 510 may be deposited ata higher temperature which may provide more consistent film uniformity.

FIGS. 6A and 6B show a portion of a first memory deck and a secondmemory deck of a multi-layer cross point memory device 600 followingdeposition of a second electrode layer that may form a bit line 115-clayer, and first electrode layer 215-d, memory storage element layer220-d, and second electrode layer 225-d of a second memory deck. FIG. 6Ashows the cross-section in the X-direction and FIG. 6B shows thecross-section in the Y-direction, similarly as discussed above withrespect to FIGS. 4-5.

In this embodiment, a blanket deposition may be used to form the secondelectrode metallization layer, which may be used to form themetallization for the bit line 115-c layer that may be shared betweenthe first memory deck and the second memory deck. In some embodiments,the second electrode metallization layer may be deposited in a singledeposition operation and thus not have an intra-layer boundary, and maybe thicker than the first electrode metallization layer of the word line110-d layer due to serving as an electrode for both the first memorydeck and the second memory deck. In other embodiments, the secondelectrode metallization layer may be deposited in two or more separatedeposition operations, or may include multiple different conductivematerials. The bit line 115-c layer may be deposited according to any ofthe deposition techniques as discussed above, followed by formation ofthe first electrode layer 215-d, memory storage element layer 220-d, andsecond electrode layer 225-d of the second memory deck. These layersmay, after processing, be examples of bit lines 115 and memory cells 105of second memory deck 210 as described with reference to FIGS. 1 and 2.Memory storage element layer 220-d may, for example, be a variableresistance material, a chalcogenide, or a phase change material. Bitline 115-c layer may be a conductive layer and may include, in someexamples, tungsten, aluminum, titanium, titanium nitride, silicon,polysilicon, or any combination thereof. Various techniques may be usedto deposit the layers of the second memory deck, including any of thedeposition techniques as discussed above.

FIGS. 7A through 7C show a portion of a first memory deck and a secondmemory deck of a multi-layer cross point memory device 700 following asecond patterning operation, a second etching operation, and a secondfilling operation in accordance with examples of the present disclosure.FIG. 7A shows the cross-section in the X-direction and FIGS. 7B and 7Cshow the cross-section in the Y-direction, similarly as discussed abovewith respect to FIGS. 4-6.

In this example, a first set of columns 705 may be patterned on thesecond electrode layer 225-d in the second patterning operation. Thefirst set of columns 705 may be columns that are patterned to correspondto bit lines 115 of FIGS. 1-2. In some instances, the pattern may beformed using photolithography techniques. Following the patterning, thesecond etching operation may etch portions of both the second memorydeck and the first memory deck. The etching operation may etch throughthe second memory deck to form the first set of columns 705, and etchthrough portions of the first set of rows 515 located between adjacentcolumns of the first set of columns 705 to form a first set of memorycells of the first memory deck. In some cases, the second etchingoperation may etch through the layers of the second memory deck,including the second electrode layer 225-d, the memory storage elementlayer 220-d, the first electrode layer 215-d of the second memory deck,etch through the bit line 115-c layer, and then etch through portions ofthe first memory deck that are located beneath and between the first setof columns 705, namely the second electrode layer 225-c, the memorystorage element layer 220-c, the first electrode layer 215-c of thefirst memory deck.

The second etching operation may stop when it gets to the word line110-d layer. In some embodiments, the etch may be stopped after etchingthe self-selecting memory material or after partial etch of the firstelectrode layer 215-c, and the first electrode layer 215-c would be inparallel, and act as a shunt, to the word line 110-d. In a similarfashion, the second electrode layer 225-c of the first deck could bedeposited after the etch in word line, providing a parallel shunt to thebit line 115-c. The second etching operation may remove material using anumber of techniques, such as discussed above. In some cases, a dryetching operation may be used that employs endpoint detection based onthe chemical composition of the material being etched, and may stopetching when material of the word line 110-d layer is detected. Incases, where the word line 110-d layer and the bit line 115-c layer areformed of the same material (e.g., tungsten), the second etching processmay continue etching through the first detection of the material (e.g.,through the first detection of tungsten associated with the bit line115-c layer) and stop upon a second detection of the material.

The second filling operation may include depositing a sealing layer 505on the first set of columns 705, and depositing a dielectric material510 between columns of the first set of columns 705. In some cases, thesecond filling operation may include a planarization operation, such asCMP to planarize the portion of the second memory deck. The sealinglayer 505 and dielectric material 510 may be formed of the samematerials as discussed above with respect to FIG. 5, and may bedeposited using one or more of the deposition techniques as discussedabove.

As can be observed in FIG. 7B, the columns 705 corresponding to bitlines 115 and the associated memory cells of both the first memory deckand the second memory deck are thus self-aligned in the direction ofcolumns 705, as both memory decks and bit line 115-c layer are etched ina same etch operation. Additionally, a width of each column of the firstset of columns 705 is a same width as a width of each respective memoryelement of the first memory deck located under each column 705, as thelayers have a same patterning registration and are etched in a sameetching operation. As can be observed in FIG. 7C in comparison to FIG.7A, a width of each column 705 may be different than a width of each rowof 110 in some cases.

FIGS. 8A and 8B show a portion of a first memory deck and a secondmemory deck of a multi-layer cross point memory device 800 followingdeposition of a third electrode layer that may form a word line 110-elayer of the second memory deck. FIG. 8A shows the cross-section in theX-direction and FIG. 8B shows the cross-section in the Y-direction,similarly as discussed above with respect to FIGS. 4-7.

In this embodiment, a blanket deposition may be used to form the thirdelectrode metallization layer, which may be used as the metallizationfor word line 110-e layer. The word line 110-e layer may be depositedaccording to any of the deposition techniques as discussed above. Wordline 110-e layer may be a conductive layer and may include, in someexamples, tungsten, aluminum, titanium, titanium nitride, silicon,polysilicon, or any combination thereof. Various techniques may be usedto deposit the word line 110-e layer of the second memory deck,including any of the deposition techniques as discussed above.

FIGS. 9A and 9B show a portion of a first memory deck and a secondmemory deck of a multi-layer cross point memory device 900 following athird patterning operation, a third etching operation, and a thirdfilling operation in accordance with examples of the present disclosure.FIG. 9A shows the cross-section in the X-direction and FIG. 9B shows thecross-section in the Y-direction, similarly as discussed above withrespect to FIGS. 4-8.

In this example, a second set of rows may be patterned on the word line110-e layer in the third patterning operation. The second set of rowsmay be patterned to overlay the first set of rows 515. While theillustrations in the drawing figures show the second set of rows alignedwith a same registration over the first set of rows 515, in practicethere may be some amount of misalignment of the different sets of rowsdue to the patterning of the different sets or rows being performed indifferent patterning operations. In some embodiments, a width of thesecond set of rows may be different than the width of the first set ofrows 515. The second set of rows may be rows that are patterned tocorrespond to word lines 110 of FIGS. 1-2.

Following the patterning, the third etching operation may etch portionsof both the word line 110-e layer and the second memory deck. Theetching operation may etch through the word line 110-e layer to form thesecond set of rows for bit lines 110-e, and etch through portions of thefirst set of columns 705 located between adjacent rows of the second setof rows to form a second set of memory cells of the second memory deck.The third etching operation may remove material using a number oftechniques, such as discussed above. In some embodiments, similarly asdiscussed above, the third etching operation may be stopped afteretching the self-selecting memory material or after partial etch of thesecond electrode layer 215-d, and the second electrode layer 215-d wouldbe in parallel, and act as a shunt, to the bit line 115-c. In a similarfashion, the third electrode layer 225-d of the second deck could bedeposited after the etch in word line, providing a parallel shunt to theword line 110-e. The third etching operation may stop when it gets tothe bit line 115-c layer.

The third filling operation may include depositing a sealing layer 505on the second set of rows, and depositing a dielectric material 510between rows of the second set of rows. In some cases, the third fillingoperation may include a planarization operation, such as CMP, toplanarize the portion of the second memory deck. The sealing layer 505and dielectric material 510 may be formed of the same materials asdiscussed above with respect to FIGS. 5 and 7, and may be depositedusing one or more of the deposition techniques as discussed above. Ascan be observed in FIG. 9A, the rows corresponding to top word lines110-e and the associated memory cells of both the second memory deck arethus self-aligned in the direction of the top rows.

Thus, the portions of the memory device 900 illustrated in FIG. 9 showtwo memory decks of a cross-point memory device that are fabricatedusing three pattern and etching operations. In some cases, more than twomemory decks may be fabricated in a memory device, and similartechniques may be used such that N decks of memory cells may befabricated using N+1 patterning and etching operations. FIGS. 10-13provide examples of other embodiments that have more than two memorydecks.

FIGS. 10A and 10B show a portion of a first memory deck, a second memorydeck, and a third memory deck of a multi-layer cross point memory device1000. In this example, the layers for the third memory deck may bedeposited after the operations discussed above with respect to FIGS. 7Aand 7B. The third memory deck may be formed from a third electrode layerthat may form a word line 110-e layer, and first electrode layer 215-e,memory storage element layer 220-e, and second electrode layer 225-e ofthe third memory deck. FIG. 10A shows the cross-section in theX-direction and FIG. 10B shows the cross-section in the Y-direction,similarly as discussed above with respect to FIGS. 4-9.

In this embodiment, a blanket deposition may be used to form the thirdelectrode metallization layer, which may be used to form themetallization for the word line 110-e layer that may be shared betweenthe second memory deck and the third memory deck. In some embodiments,the third electrode metallization layer may be deposited in a singledeposition operation, and may have a thickness that is similar to thethickness of the second electrode metallization layer of the bit line115-c layer, and that is thicker than the first electrode metallizationlayer of the word line 110-d layer, due to serving as an electrode forboth the second memory deck and the third memory deck. In otherembodiments, the third electrode metallization layer may be deposited intwo or more separate deposition operations, or may include multipledifferent conductive materials.

The word line 110-e layer may be deposited according to any of thedeposition techniques as discussed above, followed by formation of thefirst electrode layer 215-e, memory storage element layer 220-e, andsecond electrode layer 225-e of the third memory deck. These layers may,after processing, be examples of word lines 110 and memory cells 105 ofa third memory deck, as described with reference to FIGS. 1 and 2.Memory storage element layer 220-e may, for example, be a variableresistance material, a chalcogenide, or a phase change material. Wordline 110-e layer may be a conductive layer and may include, in someexamples, tungsten, aluminum, titanium, titanium nitride, silicon,polysilicon, or any combination thereof. Various techniques may be usedto deposit the layers of the third memory deck, including any of thedeposition techniques as discussed above.

FIGS. 11A and 11B show a portion of a first memory deck, a second memorydeck, and a third memory deck of a multi-layer cross point memory device1100 following a third patterning operation, a third etching operation,and a third filling operation in accordance with examples of the presentdisclosure. FIG. 11A shows the cross-section in the X-direction and FIG.11B shows the cross-section in the Y-direction, similarly as discussedabove with respect to FIGS. 4-10.

In this example, a second set of rows may be patterned on the secondelectrode layer 225-e in the third patterning operation. The second setof rows may be rows that are patterned to correspond to word lines 110of FIGS. 1-2. In some instances, the pattern may be formed usingphotolithography techniques. Following the patterning, the third etchingoperation may etch portions of both the third memory deck and the secondmemory deck. The etching operation may etch through the third memorydeck to form the second set of rows, and etch through portions of thefirst set of columns 705 located between adjacent rows of the second setof rows to form a second set of memory cells of the second memory deck.In some cases, the third etching operation may etch through the layersof the third memory deck, including the second electrode layer 225-e,the memory storage element layer 220-e, the first electrode layer 215-eof the third memory deck, etch through the word line 110-e layer, andthen etch through portions of the second memory deck that are locatedbeneath and between the second set of rows, namely the second electrodelayer 225-d, the memory storage element layer 220-d, the first electrodelayer 215-d of the second memory deck.

The third etching operation may stop when it gets to the bit line 115-clayer. The third etching operation may remove material using a number oftechniques, such as discussed above. In some cases, the etchingoperation may use endpoint detection to identify that the bit line 115-clayer has been reached, as discussed above. The third filling operationmay include depositing a sealing layer 505 on the second set of rows,and depositing a dielectric material 510 between rows of the second setof rows. In some cases, the third filling operation may include aplanarization operation, such as CMP, to planarize the portion of thethird memory deck. The sealing layer 505 and dielectric material 510 maybe formed of the same materials as discussed above with respect to FIG.5, and may be deposited using one or more of the deposition techniquesas discussed above.

As can be observed in FIG. 11B, the rows corresponding to word lines 110and the associated memory cells of both the second memory deck and thethird memory deck are thus self-aligned in the direction of the rows, asboth memory decks and word line 110-e layer are etched in a same etchoperation. Additionally, a width of each row of the second set of rowsis a same width as a width of each respective memory element of thesecond memory deck located under each row of the second set of rows, asthe layers have a same patterning registration and are etched in a sameetching operation.

FIGS. 12A and 12B show a portion of a first memory deck, a second memorydeck, and a third memory deck of a multi-layer cross point memory device1200 following deposition of a fourth electrode layer and a fourthpatterning and etching operation, that may form a bit line 115-d layerand complete formation of memory cells of the third memory deck. FIG.12A shows the cross-section in the X-direction and FIG. 12B shows thecross-section in the Y-direction, similarly as discussed above withrespect to FIGS. 4-11.

In this embodiment, a blanket deposition may be used to form the fourthelectrode metallization layer, which may be used as the metallizationfor bit line 115-d layer. The bit line 115-d layer may be depositedaccording to any of the deposition techniques as discussed above. Bitline 115-d layer may be a conductive layer and may include, in someexamples, tungsten, aluminum, titanium, titanium nitride, silicon,polysilicon, or any combination thereof. Various techniques may be usedto deposit the bit line 115-d layer of the third memory deck, includingany of the deposition techniques as discussed above.

In this example, a second set of columns may be patterned on the bitline 115-d layer in the fourth patterning operation. The second set ofcolumns may be patterned to overlay the first set of columns 705. Whilethe illustrations in the drawing figures show the second set of columnsaligned with a same registration over the first set of columns 705, inpractice there may be some amount of misalignment of the different setsof columns due to the patterning of the different sets of columns beingperformed in different patterning operations. In some embodiments, awidth of the second set of columns may be different than the width ofthe first set of columns 705. The second set of columns may be columnsthat are patterned to correspond to bit lines 115 of FIGS. 1-2.

Following the patterning, the fourth etching operation may etch portionsof both the bit line 115-d layer and the third memory deck. The etchingoperation may etch through the bit line 115-d layer to form the secondset of columns for bit lines 115-d, and etch through portions of thesecond set of rows located between adjacent columns of the second set ofcolumns to form a third set of memory cells of the third memory deck.The fourth etching operation may stop when it gets to the word line110-e layer. The fourth etching operation may remove material using anumber of techniques, such as discussed above.

The fourth filling operation may include depositing a sealing layer 505on the second set of columns, and depositing a dielectric material 510between columns of the second set of columns. In some cases, the fourthfilling operation may include a planarization operation, such as CMP, toplanarize the portion of the third memory deck. The sealing layer 505and dielectric material 510 may be formed of the same materials asdiscussed above with respect to FIGS. 5 and 11, and may be depositedusing one or more of the deposition techniques as discussed above. Ascan be observed in FIG. 12A, the columns corresponding to top bit lines115-d and the associated memory cells of the third memory deck are thusself-aligned in the direction of the top columns.

Thus, the portions of the memory device 1200 illustrated in FIG. 12 showthree memory decks of a cross-point memory device that are fabricatedusing four pattern and etching operations. FIGS. 13A and 13B show aportion of an N−1^(th) deck 1305 and an N^(th) deck of a multi-layercross point memory device 1300. FIG. 13A shows the cross-section in theX-direction and FIG. 13B shows the cross-section in the Y-direction,similarly as discussed above with respect to FIGS. 4-12. The additionaldecks of a memory device may be fabricated according to the deposition,patterning, and etching sequences as discussed above, in whichsubsequently deposited memory decks share patterning and etchingoperations with a lower memory deck in one direction to be self-alignedwith the lower memory deck in that direction, to provide that N decks ofmemory cells may be fabricated using N+1 patterning and etchingoperations. As mentioned above, in some embodiments, different pitchesmay be used for bitline and wordline directions, which may provide ahorizontal cross section of the self-selecting memory material that issquare, rectangular, or another shape, depending upon the masking andetching techniques used.

FIG. 14 is a flow diagram of a fabrication process 1400, according tovarious embodiments. Initially, a substrate may be processed at one ormore deposition tool(s) 1405 to form the layers for a first memory deck.In some cases, as discussed above, the substrate may be a semiconductorsubstrate (e.g., a silicon wafer), which may have control circuitryfabricated such that memory decks are formed on top of the controlcircuitry. In some cases, the deposition tool(s) may include ametallization deposition tool that deposits a first electrode layer, anelectrode layer deposition tool that deposits a first electrode layer, amemory element deposition tool that deposits a memory element layer, andthe electrode layer deposition tool that deposits a second electrodelayer. In some examples, the deposition tool(s) may deposit layers for amemory deck such as illustrated in FIGS. 4A and 4B. The deposition toolsmay include one or more of a CVD tool, a MOCVD tool, a PECVD tool, PVDtool, a sputter deposition tool, an ALD, a MBE tool, a spin-on tool, orother thin film deposition tool.

Following deposition of the layers for the memory deck, one or morepatterning tool(s) 1410 may deposit and pattern an etch mask into set ofetch mask lines, which may include etch masked rows or etch maskedcolumns depending upon the memory deck that is to be etched. Such anetch mask may comprise a photoresist, a dielectric, or other materialthat is relatively easy to etch into a line pattern, for example.Patterning may be performed using photolithography (e.g., direct print,expose/shift/expose, expose/positive develop/negative develop),photolithography with pitch doubling process (e.g., spacers), andimprinting, just to name a few examples.

Continuing with process 1400, one or more etching tool(s) 1415 may etchthe layers of the memory deck. In some embodiments, a plasma etchprocess may be used at etching tool(s) 1415. In other embodiments, a wetetch may be used, either alone or in combination with one or more plasmsor dry etches. The etch mask may be removed, in some examples, (e.g.,via a wet photoresist removal process). In other examples, the etch maskmay remain on the top of the memory deck layers and used as asacrificial layer in a subsequent planarization process. Once theetching is completed, sealing tool(s) 1420 may deposit a sealing layeron the rows of columns of the memory deck layers. The sealing tool(s)1420 may include processing equipment that may deposit a dielectricmaterial (e.g., SiO₂) using a CVD or PECVD process, or any other thinfilm deposition process. Dielectric filling tool(s) 1425 may depositdielectric filling material on the sealed rows or columns. Dielectricfilling tool(s) 1425 may include processing equipment that may deposit adielectric material (e.g., SiO₂) using a CVD or PECVD process, or anyother thin film deposition process. In some cases, deposition of thesealing layer may be done at a lower temperature than deposition of thedielectric filling material, to help reduce outgassing of the memoryelement layer material (e.g., to reduce chalcogenide glass outgassing)that may occur at relatively high rates if processing at highertemperatures associated with the filling material deposition were to beused in an absence of a sealing layer.

Planarization tool(s) 1430 may then planarize the memory deck, andremove excess sealing material or dielectric filling material.Planarization tool(s) 1430 may include, for example, CMP processingequipment that may planarize the memory deck, thus leaving rows orcolumns of memory deck layers, such as illustrated in FIGS. 5A and 5B.The processing at tools 1405 through 1430 may be repeated for a numberof memory decks that may be fabricated for a memory device, with anupper memory deck and a lower memory deck sharing the patterning,etching, sealing/filling, and planarization processes for one maskingdirection (e.g., a row pattern or a column pattern). For example, if amemory device has two memory decks, the processing at tools 1405 through1430 may be repeated twice, in which a first pass through etchingtool(s) 1415 may provide etching for rows of a first memory deck, and asecond pass through etching tool(s) 1415 provide etching for columns ofboth the first memory deck and a second memory deck, such as illustratedin the example of FIGS. 7A and 7B.

Following planarization of the top memory deck, top electrode depositiontool(s) 1435 may deposit a top electrode (e.g., a word line 110 or bitline 115 electrode layer). The top electrode deposition tool(s) 1435 mayinclude some of the same deposition tools 1405 that are used as part ofelectrode deposition of another electrode layer of another memory deck.Top electrode patterning tool(s) 1440 may pattern the top electrodelayer according to whether the top electrode is a word line or a bitline, for example. The top electrode patterning tool(s) 1440 may includesome of the same patterning tools 1410 that are used for patterningself-selecting memory stacks of the two or more memory decks. Topelectrode etching tool(s) 1445 may etch the top electrode and portionsof the top memory deck self-selecting memory stack. The top electrodeetching tool(s) 1445 may include some of the same etching tools 1415that are used for patterning self-selecting memory stacks of the two ormore memory decks. Top electrode layer and portions of the top memorydeck etched with the top electrode layer may be sealed, dielectricfilled, and planarized in some embodiments.

Thus, N decks of memory cells may be formed with N+1 patterning,etching, and dielectric sealing/filling processes, and portions ofmemory decks that are etched in the same etching processes are alsoself-aligned. Compared to processing in which both rows and columns of amemory deck are separately processed for each memory deck, which wouldrequire 2N patterning, etching, and sealing/filling processes, such areduction may provide substantial manufacturing efficiencies. Forexample, fabricating memory devices with two memory decks may use 3patterning, etching, and sealing/filling operations compared to 4 suchoperations if separate processing per memory deck were used, resultingin a 25% reduction in such processing operations. In cases where apatterning, etching, or sealing/filling (or associated planarization)operation is a bottleneck in a fabrication facility, such a reduction inprocessing steps can increase a production capability of a fabricationfacility by a similar percentage (e.g., a fab with a 5000 wafer startsper week (WSPW) capacity may be potentially increased to 6250 WSPW). Inany case, such a reduction in processing steps reduces cost and cycletime of memory device fabrication, which provides for more efficientfabrication and likely fewer defects to thereby also enhance yield.

FIG. 15 shows a flowchart illustrating a method 1500 for formingself-aligned memory decks in cross-point memory arrays in accordancewith various aspects of the present disclosure. The operations of method1500 may be performed by processing tools described with reference toFIG. 14.

At block 1505 one or more deposition tools may form, on a substrate, afirst electrode layer and a first self-selecting memory stack on thefirst electrode layer. The operations of block 1505 may be performedaccording to the methods described with reference to FIGS. 4 through 13.In certain examples, aspects of the operations of block 1505 may beperformed by deposition tools as described with reference to FIG. 14.

At block 1510 one or more etching tools may etch, in a first etchingoperation, the first electrode layer and the first self-selecting memorystack to form a first set of rows extending in a first direction on thesubstrate, each row of the first set of rows comprising the firstelectrode layer and the first self-selecting memory stack. Theoperations of block 1510 may be performed according to the methodsdescribed with reference to FIGS. 4 through 13. In certain examples,aspects of the operations of block 1510 may be performed by etchingtools as described with reference to FIG. 14. In some cases, dielectricsealing and/or filling material may be deposited between each row of thefirst set of rows, and in some cases also may be planarized.

At block 1515 the one or more deposition tools may form a secondelectrode layer and a second self-selecting memory stack on the firstset of rows. The operations of block 1515 may be performed according tothe methods described with reference to FIGS. 4 through 13. In certainexamples, aspects of the operations of block 1515 may be performed bydeposition tools as described with reference to FIG. 14.

At block 1520 the one or more etching tools may etch, in a secondetching operation, the second electrode layer and the secondself-selecting memory stack to form a first set of columns extending ina second direction on the first set of rows, each column of the firstset of columns comprising the second electrode layer and the secondself-selecting memory stack. The operations of block 1520 may beperformed according to the methods described with reference to FIGS. 4through 13. In certain examples, aspects of the operations of block 1520may be performed by etching tools as described with reference to FIG.14.

At block 1525 the one or more etching tools also may etch, in the secondetching operation, portions of the first set of rows located betweenadjacent columns of the first set of columns to form a first set ofmemory cells. The operations of block 1525 may be performed according tothe methods described with reference to FIGS. 4 through 13. In certainexamples, aspects of the operations of block 1525 may be performed byetching tools as described with reference to FIG. 14. In some cases, thesecond etching operation comprises: etching through the secondself-selecting memory stack, through the second electrode layer, andthrough portions of the first self-selecting memory stack below andbetween adjacent columns the first set of columns.

In some cases, the second electrode is formed in a single depositionprocess and is etched in a single etching process as part of the secondetching process. In some cases, each self-selecting memory stackcomprises a first layer of carbon, a layer of chalcogenide glass on thefirst layer of carbon, and a second layer of carbon on the layer ofchalcogenide glass. In some cases, a width of each column of the firstset of columns is a same width as a width of each respective memoryelement located under each column of the first set of columns. In somecases, the second electrode layer forms an upper access line for acolumn of memory cells of the first set of memory cells that are locatedunder each column of the first set of columns, and forms a lower accessline for a second column of a second set of memory cells formed usingthe second self-selecting memory stack.

FIG. 16 shows a flowchart illustrating a method 1600 for formingself-aligned memory decks in cross-point memory arrays in accordancewith various aspects of the present disclosure. The operations of method1600 may be performed by processing tools described with reference toFIG. 14.

At block 1605 the processing tools may form, on a substrate, a firstelectrode layer and a first self-selecting memory stack on the firstelectrode layer. The operations of block 1605 may be performed accordingto the methods described with reference to FIGS. 4 through 13. Incertain examples, aspects of the operations of block 1605 may beperformed by deposition tools as described with reference to FIG. 14.

At block 1610 the processing tools may etch, in a first etchingoperation, the first electrode layer and the first self-selecting memorystack to form a first set of rows extending in a first direction on thesubstrate, each row of the first set of rows comprising the firstelectrode layer and the first self-selecting memory stack. Theoperations of block 1610 may be performed according to the methodsdescribed with reference to FIGS. 4 through 13. In certain examples,aspects of the operations of block 1610 may be performed by etchingtools as described with reference to FIG. 14. In some cases, one or moreetching operations of FIG. 16 may also include dielectric sealing andfilling, and planarization operations.

At block 1615 the processing tools may form a second electrode layer anda second self-selecting memory stack on the first set of rows. Theoperations of block 1615 may be performed according to the methodsdescribed with reference to FIGS. 4 through 13. In certain examples,aspects of the operations of block 1615 may be performed by depositiontools as described with reference to FIG. 14.

At block 1620 the processing tools may etch, in a second etchingoperation, the second electrode layer and the second self-selectingmemory stack to form a first set of columns extending in a seconddirection on the first set of rows, each column of the first set ofcolumns comprising the second electrode layer and the secondself-selecting memory stack. The operations of block 1620 may beperformed according to the methods described with reference to FIGS. 4through 13. In certain examples, aspects of the operations of block 1620may be performed by etching tools as described with reference to FIG.14.

At block 1625 the processing tools may etch, in the second etchingoperation, portions of the first set of rows located between adjacentcolumns of the first set of columns to form a first set of memory cells.The operations of block 1625 may be performed according to the methodsdescribed with reference to FIGS. 4 through 13. In certain examples,aspects of the operations of block 1625 may be performed by etchingtools as described with reference to FIG. 14.

At block 1630 it may be determined if the most recent etching operationis an etching operation on a top deck of memory cells of the memorydevice. Such a determination may be made, for example, based on a numberof decks of memory cells that are to be fabricated and a correspondingnumber of memory stacks that have been deposited and etched.

If the deck of memory cells is not the top deck, then at block 1635 theprocessing tools may form an N^(th) electrode layer and an N^(th)self-selecting memory stack on the N−1^(th) set of rows/columns. Theoperations of block 1635 may be performed according to the methodsdescribed with reference to FIGS. 4 through 13. In certain examples,aspects of the operations of block 1635 may be performed by depositiontools as described with reference to FIG. 14.

At block 1640 the processing tools may etch, in an N^(th) etchingoperation, the N^(th) electrode layer and the N^(th) self-selectingmemory stack to form a N^(th) set of rows/columns on the N−1^(th) set ofcolumns, and may etch, in the N^(th) etching operation, portions of theN−1^(th) set of rows/columns to form an N−1^(th) set of memory cells.The operations of block 1640 may be performed according to the methodsdescribed with reference to FIGS. 4 through 13. In certain examples,aspects of the operations of block 1640 may be performed by etchingtools as described with reference to FIG. 14. The operations of block1630 may then be repeated.

If the deck of memory cells is the top deck, then at block 1645 theprocessing tools may form a top electrode layer on the set ofrows/columns of the top memory deck. The operations of block 1645 may beperformed according to the methods described with reference to FIGS. 4through 13. In certain examples, aspects of the operations of block 1645may be performed by deposition tools as described with reference to FIG.14.

At block 1650 the processing tools may etch, the top electrode layer toform a top set of rows/columns. The operations of block 1650 may beperformed according to the methods described with reference to FIGS. 4through 13. In certain examples, aspects of the operations of block 1650may be performed by etching tools as described with reference to FIG.14.

At block 1655 the processing tools also may etch, in the same etchingoperation used to etch top electrode layer, portions of the set ofcolumns/rows located between adjacent columns/rows of the top electrodelayer to form top set of memory cells of the top memory deck. Theoperations of block 1655 may be performed according to the methodsdescribed with reference to FIGS. 4 through 13. In certain examples,aspects of the operations of block 1655 may be performed by etchingtools as described with reference to FIG. 14.

FIG. 16 shows a flowchart illustrating a method 1600 for formingself-aligned memory decks in cross-point memory arrays in accordancewith various aspects of the present disclosure. The operations of method1600 may be implemented by processing components as described hereinaccording to the techniques as described with reference to FIG. 14.

At block 1605 the processing tools may form, on a substrate, controlcircuitry for controlling a plurality of stacked decks of athree-dimensional cross point memory, the plurality of stacked deckscomprising N decks. The operations of block 1605 may be performedaccording to the methods described with reference to FIGS. 1 through 13.In certain examples, aspects of the operations of block 1605 may beperformed by deposition, patterning, etching, and planarization tools asdescribed with reference to FIG. 14.

At block 1610 the processing tools may form, over at least a portion ofthe control circuitry, at least a portion of the plurality of stackeddecks using N+1 mask operations and N+1 etch operations. Each maskoperation may include one or more mask steps (e.g., two mask steps for adouble-patterning mask operation), and each etch operation may includeone or more etching steps (e.g., two separate plasma etching steps foran etching operation). The operations of block 1610 may be performedaccording to the methods described with reference to FIGS. 4 through 13.In certain examples, aspects of the operations of block 1610 may beperformed by a deposition, patterning, planarization, and etching toolsas described with reference to FIG. 14.

It should be noted that the methods described above describe possibleimplementations, and that the operations and the steps may be rearrangedor otherwise modified and that other implementations are possible.Furthermore, embodiments from two or more of the methods may becombined.

The term “electronic communication” and “coupled” as used herein referto a relationship between components that support electron flow betweenthe components. This may include a direct connection between componentsor may include intermediate components. Components in electroniccommunication or coupled to one another may be actively exchangingelectrons or signals (e.g., in an energized circuit) or may not beactively exchanging electrons or signals (e.g., in a de-energizedcircuit) but may be configured and operable to exchange electrons orsignals upon a circuit being energized. By way of example, twocomponents physically connected via a switch (e.g., a transistor) are inelectronic communication or may be coupled regardless of the state ofthe switch (i.e., open or closed).

The term “layer” used herein refers to a stratum or sheet of ageometrical structure. Each layer may have three dimensions (e.g.,height, width, and depth) and may cover some or all of a surface. Forexample, a layer may be a three-dimensional structure where twodimensions are greater than a third, e.g., a thin-film. Layers mayinclude different elements, components, and/or materials. In some cases,one layer may be composed of two or more sublayers. In some of theappended figures, two dimensions of a three-dimensional layer aredepicted for purposes of illustration. Those skilled in the art will,however, recognize that the layers are three-dimensional in nature. Theterm “layer” also refers to any material initially formed as a stratumor sheet and that remains following one or more other processingoperations, such as patterning and/or etching operations, for example.

As used herein, the term “substantially” means that the modifiedcharacteristic (e.g., a verb or adjective modified by the termsubstantially) need not be absolute but is close enough so as to achievethe advantages of the characteristic.

As used herein, the term “electrode” may refer to an electricalconductor, and in some cases, may be employed as an electrical contactto a memory cell or other component of a memory array. An electrode mayinclude a trace, wire, conductive line, conductive layer, or the likethat provides a conductive path between elements or components of memoryarray 100.

The term “photolithography,” as used herein, may refer to the process ofpatterning using photoresist materials and exposing such materials usingelectromagnetic radiation. For example, a photoresist material may beformed on a base material by, for example, spin-coating the photoresiston the base material. A pattern may be created in the photoresist byexposing the photoresist to radiation. The pattern may be defined by,for example, a photo mask that spatially delineates where the radiationexposes the photoresist. Exposed photoresist areas may then be removed,for example, by chemical treatment, leaving behind the desired pattern.In some cases, the exposed regions may remain and the unexposed regionsmay be removed.

Chalcogenide materials may be materials or alloys that include at leastone of the elements S, Se, and Te. Phase change materials or variableresistance materials discussed herein may be chalcogenide materials.Chalcogenide materials may include alloys of S, Se, Te, Ge, As, Al, Sb,Au, indium (In), gallium (Ga), tin (Sn), bismuth (Bi), palladium (Pd),cobalt (Co), oxygen (O), silver (Ag), nickel (Ni), platinum (Pt).Example chalcogenide materials and alloys may include, but are notlimited to, Ge—Te, In—Se, Sb—Te, Ga—Sb, In—Sb, As—Te, Al—Te, Ge—Sb—Te,Te—Ge—As, In—Sb—Te, Te—Sn—Se, Ge—Se—Ga, Bi—Se—Sb, Ga—Se—Te, Sn—Sb—Te,In—Sb—Ge, Te—Ge—Sb—S, Te—Ge—Sn—O, Te—Ge—Sn—Au, Pd—Te—Ge—Sn, In—Se—Ti—Co,Ge—Sb—Te—Pd, Ge—Sb—Te—Co, Sb—Te—Bi—Se, Ag—In—Sb—Te, Ge—Sb—Se—Te,Ge—Sn—Sb—Te, Ge—Te—Sn—Ni, Ge—Te—Sn—Pd, or Ge—Te—Sn—Pt. The hyphenatedchemical composition notation, as used herein, indicates the elementsincluded in a particular compound or alloy and is intended to representall stoichiometries involving the indicated elements. For example, Ge—Temay include Ge_(x)Te_(y), where x and y may be any positive integer.Other examples of variable resistance materials may include binary metaloxide materials or mixed valence oxide including two or more metals,e.g., transition metals, alkaline earth metals, and/or rare earthmetals. Embodiments are not limited to a particular variable resistancematerial or materials associated with the memory elements of the memorycells. For example, other examples of variable resistance materials canbe used to form memory elements and may include chalcogenide materials,colossal magnetoresistive materials, or polymer-based materials, amongothers.

The term “isolated” refers to a relationship between components in whichelectrons are not presently capable of flowing between them; componentsare isolated from each other if there is an open circuit between them.For example, two components physically connected by a switch may beisolated from each other when the switch is open.

The devices discussed herein, including memory array 100, may be formedon a semiconductor substrate, such as silicon, germanium,silicon-germanium alloy, gallium arsenide, gallium nitride, etc. In somecases, the substrate is a semiconductor wafer. In other cases, thesubstrate may be a silicon-on-insulator (SOI) substrate, such assilicon-on-glass (SOG) or silicon-on-sapphire (SOP), or epitaxial layersof semiconductor materials on another substrate. The conductivity of thesubstrate, or sub-regions of the substrate, may be controlled throughdoping using various chemical species including, but not limited to,phosphorous, boron, or arsenic. Doping may be performed during theinitial formation or growth of the substrate, by ion-implantation,diffusion, or by any other doping means.

A transistor or transistors discussed herein may represent afield-effect transistor (FET) and comprise a three terminal deviceincluding a source, drain, and gate. The terminals may be connected toother electronic elements through conductive materials, e.g., metals.The source and drain may be conductive and may comprise a heavily-doped,e.g., degenerate, semiconductor region. The source and drain may beseparated by a lightly-doped semiconductor region or channel. If thechannel is n-type (i.e., majority carriers are electrons), then the FETmay be referred to as a n-type FET. If the channel is p-type (i.e.,majority carriers are holes), then the FET may be referred to as ap-type FET. The channel may be capped by an insulating gate oxide. Thechannel conductivity may be controlled by applying a voltage to thegate. For example, applying a positive voltage or negative voltage to ann-type FET or a p-type FET, respectively, may result in the channelbecoming conductive. A transistor may be “on” or “activated” when avoltage greater than or equal to the transistor's threshold voltage isapplied to the transistor gate. The transistor may be “off” or“deactivated” when a voltage less than the transistor's thresholdvoltage is applied to the transistor gate.

The description set forth herein, in connection with the appendeddrawings, describes example configurations and does not represent allthe examples that may be implemented or that are within the scope of theclaims. The term “exemplary” used herein means “serving as an example,instance, or illustration,” and not “preferred” or “advantageous overother examples.” The detailed description includes specific details forthe purpose of providing an understanding of the described techniques.These techniques, however, may be practiced without these specificdetails. In some instances, well-known structures and devices are shownin block diagram form in order to avoid obscuring the concepts of thedescribed examples.

In the appended figures, similar components or features may have thesame reference label. Further, various components of the same type maybe distinguished by following the reference label by a dash and a secondlabel that distinguishes among the similar components. If just the firstreference label is used in the specification, the description isapplicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

The various illustrative control or sensing blocks and modules describedin connection with the disclosure herein may be implemented or performedwith a general-purpose processor, a DSP, an ASIC, an FPGA or otherprogrammable logic device, discrete gate or transistor logic, discretehardware components, or any combination thereof designed to perform thefunctions described herein. A general-purpose processor may be amicroprocessor, but in the alternative, the processor may be anyconventional processor, controller, microcontroller, or state machine. Aprocessor may also be implemented as a combination of computing devices(e.g., a combination of a digital signal processor (DSP) and amicroprocessor, multiple microprocessors, one or more microprocessors inconjunction with a DSP core, or any other such configuration).

The functions (e.g., control functions, sensing functions, read/writefunctions) described herein may be implemented in hardware, softwareexecuted by a processor, firmware, or any combination thereof. Also, asused herein, including in the claims, “or” as used in a list of items(for example, a list of items prefaced by a phrase such as “at least oneof” or “one or more of”) indicates an inclusive list such that, forexample, a list of at least one of A, B, or C means A or B or C or AB orAC or BC or ABC (i.e., A and B and C). Also, as used herein, the phrase“based on” shall not be construed as a reference to a closed set ofconditions. For example, an exemplary step that is described as “basedon condition A” may be based on both a condition A and a condition Bwithout departing from the scope of the present disclosure. In otherwords, as used herein, the phrase “based on” shall be construed in thesame manner as the phrase “based at least in part on.”

The description herein is provided to enable a person skilled in the artto make or use the disclosure. Various modifications to the disclosurewill be readily apparent to those skilled in the art, and the genericprinciples defined herein may be applied to other variations withoutdeparting from the scope of the disclosure. Thus, the disclosure is notlimited to the examples and designs described herein, but is to beaccorded the broadest scope consistent with the principles and novelfeatures disclosed herein.

What is claimed is:
 1. A method of fabricating an electronic devicecomprising: forming, on a substrate, a first access line layer and afirst self-selecting memory stack on the first access line layer,wherein the first self-selecting memory stack comprises a barriermaterial layer and a first layer of chalcogenide glass for bothselection and storage; etching, in a first etching operation, the firstaccess line layer and the first self-selecting memory stack to form afirst set of rows extending in a first direction on the substrate, eachrow of the first set of rows comprising remaining portions of the firstaccess line layer and the first self-selecting memory stack; forming asecond access line layer and a second self-selecting memory stack on thefirst set of rows, wherein the second self-selecting memory stackcomprises a second layer of chalcogenide glass for both selection andstorage; etching, in a second etching operation, the second access linelayer and the second self-selecting memory stack to form a first set ofcolumns extending in a second direction on the first set of rows, eachcolumn of the first set of columns comprising remaining portions of thesecond access line layer and the second self-selecting memory stack; andetching, in the second etching operation, portions of the first set ofrows located between adjacent columns of the first set of columns toform a first set of memory cells, wherein etching the portions of thefirst set of rows comprises etching a portion of the first memory stackand stopping the second etching operation while etching the barriermaterial layer of the first memory stack to leave a remaining portion ofthe barrier material layer of the first memory stack as a shunt for thefirst access line layer.
 2. The method of claim 1, further comprising:forming a third access line layer on the first set of columns; etching,in a third etching operation, the third access line layer to form asecond set of rows extending in the first direction on the first set ofcolumns, each row of the second set of rows comprising the third accessline layer; and etching, in the third etching operation, portions of thefirst set of columns located between adjacent rows of the second set ofrows to form a second set of memory cells.
 3. The method of claim 1,further comprising: forming a third access line layer and a thirdself-selecting memory stack on the first set of columns, wherein thethird self-selecting memory stack comprises a third layer ofchalcogenide glass for both selection and storage; etching, in a thirdetching operation, the third access line layer and the thirdself-selecting memory stack to form a second set of rows extending inthe first direction on the first set of columns, each row of the secondset of rows comprising the third access line layer and the thirdself-selecting memory stack; and etching, in the third etchingoperation, portions of the second set of rows located between adjacentcolumns of the first set of columns to form a second set of memorycells.
 4. The method of claim 3, further comprising: forming a fourthaccess line layer on the second set of rows; etching, in a fourthetching operation, the fourth access line layer to form a second set ofcolumns extending in the second direction on the second set of rows,each column of the second set of columns comprising the fourth accessline layer; and etching, in the fourth etching operation, portions ofthe second set of rows located between adjacent columns of the secondset of columns to form a third set of memory cells.
 5. The method ofclaim 1, wherein the barrier material layer is below and in contact withthe first layer of chalcogenide glass, and wherein the firstself-selecting memory stack further comprises a second barrier materiallayer above and in contact with the first layer of chalcogenide glass.6. The method of claim 1, wherein stopping the second etching operationcomprises: detecting a chemical composition of a material being etched;and stopping the second etching operation based on the detected chemicalcomposition.
 7. The method of claim 1, wherein a width of each column ofthe first set of columns is a same width as a width of each respectivememory element located under each column of the first set of columns. 8.The method of claim 7, wherein the width of each column is a same widthas a width of each row.
 9. The method of claim 7, wherein the width ofeach column is a different width as a width of each row.
 10. The methodof claim 1, wherein the second access line layer forms an upper accessline for a column of memory cells of the first set of memory cells thatare located under each column of the first set of columns, and forms alower access line for a second column of a second set of memory cellsformed using the second self-selecting memory stack.
 11. The method ofclaim 10, wherein the second access line layer is formed in a singledeposition process and is etched in a single etching process as part ofthe second etching operation.
 12. The method of claim 1, wherein thefirst etching operation exposes a sidewall of the first self-selectingmemory stack and the second etching operation exposes a sidewall of thesecond self-selecting memory stack, the method further comprising:forming a first sealing layer in contact with the sidewall of the firstself-selecting memory stack, the first sealing layer configured tomaintain a chemical composition of the first layer of chalcogenideglass; and forming a second sealing layer in contact with the sidewallof the second self-selecting memory stack, the second sealing layerconfigured to maintain a chemical composition of the second layer ofchalcogenide glass.
 13. The method of claim 12, further comprising:depositing, after forming the first sealing layer, a dielectric materialbetween rows of the first set of rows; and depositing, after forming thesecond sealing layer, the dielectric material between columns of thefirst set of columns.
 14. The method of claim 13, further comprising:forming the first sealing layer and the second sealing layer at a firsttemperature; and depositing the dielectric material at a secondtemperature that is greater than the first temperature.
 15. A method offabricating an electronic device comprising: forming, on a substrate,control circuitry for controlling a plurality of stacked decks of athree-dimensional cross point memory, the plurality of stacked deckscomprising N decks, wherein each stacked deck of the plurality ofstacked decks comprises at least a self-selecting memory stack thatcomprises: a partially-etched continuous barrier material layer as ashunt for one or more access lines of the plurality of stacked decks anda layer of chalcogenide glass for both selection and storage; andforming, over at least a portion of the control circuitry, at least aportion of the plurality of stacked decks using N+1 mask operations andN+1 etch operations.
 16. The method of claim 15, wherein forming theplurality of stacked decks comprises: forming a first plurality of rowsof a first deck of the stacked decks of the plurality of stacked decksthat each comprise a first access line layer and a first self-selectingmemory stack; forming a second access line layer on the first pluralityof rows and a second self-selecting memory stack on the second accessline layer; patterning a first plurality of columns on the secondself-selecting memory stack; and etching, in a single etching operation,the second self-selecting memory stack, the second access line layer,and portions of the first self-selecting memory stack that are locatedbetween adjacent columns of the first plurality of columns, wherein thesingle etching operation comprises etching a portion of a barriermaterial layer of the first self-selecting memory stack and stopping theetching operation while etching the barrier material layer to leave aremaining portion of the barrier material layer as a shunt for one ormore access lines of the first plurality of rows of the first deck. 17.The method of claim 16, wherein stopping the etching operationcomprises: detecting a chemical composition of a material being etched;and stopping the etching operation based on the detected chemicalcomposition.